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High-performance QFN/DFN frame...
High-performance QFN/DFN frame packaging solution
Product dimensions:Supports ultra-thin packaging ...
Application fields:Power management chips, microc...

YDCHIP

Carrier board packaging series
Carrier board packaging series
Product dimensions:Supports a maximum carrier boa...
Application fields:Memory chips, processor chips,...

YDCHIP

High-density 2.5D/3D integrate...
High-density 2.5D/3D integrated packaging solutions
Product dimensions:It can be customized according...
Application fields:Smartphones, tablet computers,...

YDCHIP

High-density SIP system-level ...
High-density SIP system-level packaging product
Product dimensions:It can be customized according...
Application fields:Fingerprint recognition module...

YDCHIP

Advanced wafer-level packaging...
Advanced wafer-level packaging solutions
Product dimensions:Supports processing of 8-inch ...
Application fields:Smartphone camera chips, senso...

YDCHIP

High-reliability special packa...
High-reliability special packaging chip series
Product dimensions:Customized packaging dimension...
Application fields:Automotive electronics, medica...

YDCHIP