Focus on fast chip packaging and small batch testing

|24-hour sample delivery | Supports multiple packaging forms such as FC/BGA/QFN/WLCSP/SIP

Yudixin Semiconductor | Chip Speed Packaging Solution Service Provider; 
Chip packaging+testing+failure analysis full chain service, solving your full packaging and testing needs; 

YCHIPWAY

Research and development, testing, and module integration

National high-tech enterprise, national level specialized and innovative enterprise

The factory provides 7× to domestic customers; 24-hour technical support and 48 hour sample delivery, synchronized completion of IECQ 
and RoHS international filingThrough local warehousing and compliant customs declaration processes, we can cooperate with customers to directly
 send packaged finished products to overseas production lines, reducing intermediate links
    About Us
    About Us 
    01
    Yudixin Semiconductor is a professional service provider in China that focuses on fast chip packaging and small batch packaging and testing. It is deeply rooted in the field of integrated circuit packaging and testing, with "fast delivery, full process coverage, and high reliability quality" as its core. It provides customers with 24-hour/48 urgent packaging, chip sampling, and one-stop packaging and testing solutions, completely solving the industry pain points of long delivery times and high minimum order thresholds in traditional packaging and testing. 

    The company has standardized clean production workshops for thousands/tens of thousands of levels, and has introduced advanced equipment for high-precision bonding, mounting, plastic packaging, and testing processes. It has also established a dedicated fast sealing green channel, supporting a minimum order of 1 piece without threshold, covering all categories of processes such as QFN/BGA/FC flip chip/SiP/wafer level packaging, and can meet the packaging and testing needs of multiple industries and the entire cycle. 

    The company has passed ISO9001 quality management system and IATF16949 vehicle specification level system certification, and implements strict standardized quality control throughout the entire process. Even urgent orders are equally guaranteed to ensure product reliability and consistency. We are committed to becoming a trusted partner for customers in rapid sealing and testing, helping products land quickly and seize market opportunities. 

    25000+

    Industry customer trust choice

    11 years

    Integrity service provider

    25000+

    Industry customer trust choice

    15 items

    National patented technology

    25000+

    Industry customer trust choice

    12 years

    Rich industry experience

    25000+

    Industry customer trust choice

    98%

    The above customer satisfaction rate

    25000+

    Industry customer trust choice

    • Framework encapsulation series  
      For QFN/DFN and other framework products, we support product size customization and have over a hundred types of framework molds available; The product reliability meets the MSL1 standard and is equipped with plastic packaging molds and grinding equipment suitable for ultra-thin discrete components.   
    • Carrier board packaging series 
      Using LGA/BGA and other packaging forms, we provide one-stop services for packaging board design, procurement, chip packaging, and finished product testing; Equipped with two types of plastic packaging molding processes, die-casting and immersion, to meet packaging requirements of different thicknesses and densities.   
    • Integrated Packaging Series 

      Our main product is 2.5D/3D integrated packaging, which supports multi-layer wafer stacking. Currently, we can achieve up to 16 layers of FLASH wafer stacking, and can complete integrated packaging through vertical or dual channel tiling.   
    • Advanced Packaging Series
      Focusing on SIP system level packaging, different functional chips/module systems can be integrated into a single chip, using flip chip and wire hybrid bonding methods to achieve smaller chip size and higher integration.   
    • Wafer level packaging series
      Covering wafer level CSP packaging, RDL rewiring, Bumping bump fabrication and other wafer level packaging processes, it can meet various wafer packaging needs of customers.   
    • Special packaging series
      Targeting automotive grade, medical grade, and aerospace grade chips/modules, with corresponding authoritative certifications: medical chips have passed NMPA registration, EU CE, and US FDA certification, meeting standards such as ISO 13485 and IEC 60601; Aerospace chips have passed four major certifications, including aerospace grade high reliability, and comply with domestic and international standards such as MIL-STD-883, DO-254, GJB/GB.   
    02
    Full category packaging service 
    Range of services    

    Breakthrough application of high-density SIP system level packaging technology in the field of bank card fingerprint key chips

    This case demonstrates the significant breakthrough of high-density SIP (System in Package) technology in the field of financial payment security.
    Product Case 2026-06-03

    Breakthrough in high-density 2.5D/3D integrated packaging technology: Successful case of embedded EMMC packaging products

    This case study provides a detailed introduction to the successful development and industrial application of embedded EMMC packaging products based on advanced high-density 2.5D/3D integrated packaging technology.
    Product Case 2026-06-03

    Successful Case of BGA132 NAND FLASH Storage Particle Carrier Board Packaging

    This case study provides a detailed introduction to the successful application of BGA132 NAND FLASH storage granule packaging technology in our company's carrier packaging series.
    Product Case 2026-06-03

    Success Stories of High-Performance QFN/DFN Frame Packaging Solutions

    This case study demonstrates our company's breakthrough solution for the motor drive chip field, leveraging advanced high-performance QFN/DFN frame packaging technology. Through innovative heterogeneous integration packaging processes, we have successfully integrated nine chips with different functions into a single QFN package measuring only 6×6mm, achieving ultimate miniaturization and high integration of the motor drive system.
    Product Case 2026-06-03
    Product Case
    03
    Products case    
    Core advantages 
    Core Advantages 
    • 仿真设计

      Fast delivery, one step faster than others;

      The core process can ship samples within 24 hours at the fastest, and regular sampling can be delivered within 48-72 hours. For urgent orders, there is a dedicated green channel, and a dedicated person follows up on the entire process to prevent delays; 
      •     24-hour/48h/72h graded rapid sealing
       system;
      •     Exclusive fast sealing green channel 
      and independent production line;
      •     Evaluation and quotation of high-
      speed solutions within 1 hour; 
      •     Priority production scheduling throughout 
      the entire process, seamless integration; 
      •     Multi category parallel urgent 
      production capacity; 
      •     Exclusive account manager 1-on-1 
      progress follow-up;
      •     Real time synchronization of production 
      progress, fully traceable throughout the process; 
      •     Urgent orders with equivalent quality 
      control standards;
      •     Full process coverage, no need for 
      disassembly and docking; 
      •     1 minimum order without expedited 
      threshold; 
    • 先进制造

      Full process coverage one-stop service;

      Covering the full range of DIP/SOP/QFN/BGA/FC flip chip/WLCSP/SIP packaging processes, providing solution design→ Encapsulation→ Testing→ Full process service for failure analysis, one-stop solution for all sealing and testing requirements; 
      •     Full coverage of packaging technology 
      for all categories; 
      •     Traditional packaging: SOP/SOT/DIP/
      QFN/QFP  
      •     Ball grid array packaging: BGA/LGA/
      PGA; 
      •     Advanced packaging: FC flip chip/
      WLCSP/Fan out; 
      •     Customization: SiP/Chiplet/Power 
      Device Packaging;   
      •     1 piece minimum order, no minimum order 
      quantity threshold; 
      •     Suitable for all levels of consumer, industrial,
       and automotive specifications; 
      •     Smooth undertaking of the entire cycle from 
      sampling, trial production to mass production; 
      •     Wafer thinning/cutting/cleaning supporting 
      processing capability; 
      •     The full process capability of Bumping 
      convex point production; 
    • 品质保证

      Flexible production with worry free small batch production;   

      Supports a minimum order quantity of 1 piece, with no minimum order quantity threshold, perfectly matching the needs of R&D sampling, engineering trial production, and small and medium-sized mass production, without the need to pay extra for large minimum order quantities
      •     ISO9001/IATF16949 dual system 
      certification; 
      •     Whole process standardized quality 
      control system; 
      •     Full inspection of incoming materials
       to prevent the flow of defective materials; 
      •     First article inspection+patrol inspection
      +full inspection of key processes; 
      •     100% monitoring and traceability of 
      core process parameters; 
      •     Vehicle grade AEC-Q100 comprehensive 
      testing capability; 
      •     Professional technical support for failure 
      analysis and defect localization; 
      •     The data of the entire batch of products can 
      be traced and archived for reference; 
      •     Complete supporting reliability testing 
      capability; 
      •     Full inspection of finished product appearance
      +dual verification of electrical testing; 
    • 交付服务

      Vehicle grade quality, controllable throughout the entire 
      process; 

      Through IATF16949/ISO9001 dual certification, Class 1000 high standard clean workshop, imported high-end sealing and testing equipment, full process quality control, supporting reliability testing and failure analysis, ensuring product yield and stability;
      •     One stop service for packaging design, 
      processing, and testing; 
      •     Professional Engineer Team 1-on-1 
      Technical Support; 
      •     Packaging solution optimization, 
      simulation design supporting services; 
      •     Customized sample making and batch
       production of substrate/lead frame 
      •     7× 24-hour fast response, rapid 
      demand docking  
      •     Nationwide high-speed logistics delivery 
      ensures timely delivery; 
      •     After sales rework and repair, full technical 
      support guarantee; 
      •     Seamless connection throughout the entire cycle
       sampling-trial production-mass production
      •     Full process services for finished product 
      tape, laser marking, and packaging; 
      •     Electrical testing/reliability testing/failure 
      analysis; 
    Why choose Yudixin Quick Sealing?   
    Resolve the four core pain points of slow chip packaging testing and sampling, high minimum order quantity, incomplete process, and unstable delivery time
    04
    Application Fields
    Application Area
    Yudixin provides fast packaging and full category packaging and testing services for chips, covering six core areas including consumer electronics, automotive electronics, industrial control, AI computing power, medical electronics, and the Internet of Things (IoT). We offer customized, highly reliable, and fast delivery chip packaging and testing solutions for customers in different industries, meeting the full cycle needs from R&D sampling, small and medium-sized trial production to mass production ramp up.  
    05
    04
    Consumer Electronics;
    Chips for consumer products such as smartphones, TWS earphones, smart wearables, tablets, and digital devices
    移动智能终端
    Automotive Electronics
    Supporting chips for in-vehicle MCU, power management chips, sensors, and intelligent driving 
    移动智能终端
    Industrial control
    Industrial-grade chips for fields such as industrial automation, power electronics, new energy, and rail transit
    移动智能终端
    AI and computing chips
    For AI chips, computing power chips, high-speed interface chips, and high-end processors
    移动智能终端
    Medical Electronics
    Supporting chips for medical monitoring devices, diagnostic instruments, portable medical equipment, and life sciences
    移动智能终端
    Internet of Things (IoT)
    Low-power, miniaturized chips for smart homes, sensing nodes, wireless communication modules, IoT terminals, etc
    移动智能终端
    Collaboration partners
    Business Partners
    06