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  • Research and Development Assistant Engineer 
    Job responsibilities 
    1、TheMaster the basic characteristics of mainstream packaging forms (QFN/BGA/CSP, etc.), be able to identify process adaptability requirements based on chip types and customer needs, cooperate with core engineers, and understand process solutions without deviating from the actual production of the factory.   
    2、TheUnderstand the basic industry standards related to chip packaging (such as IPC basic specifications) and the core requirements of the factory quality management system (ISO9001), be able to comply with the specifications in work, and ensure compliance with auxiliary work.   
    3、TheProficient in using office software (Excel, Word, PPT), able to accurately record experimental data, prepare basic reports (yield statistics table, material consumption table), draw simple charts (trend chart, comparison table), assist core engineers in data organization and analysis; Understand the basic operations of professional software such as layout design and process simulation, and be able to cooperate in completing auxiliary work such as file organization and basic inspection.   
    4、TheMaster the usage of basic testing tools (calipers, microscopes, multimeters, etc.), be able to complete sample appearance inspection, simple size measurement, basic electrical performance testing, accurately record test results, and provide basic data for quality analysis.   
    5、TheHaving a rigorous awareness of data analysis, able to accurately record various types of data (process parameters, yield, equipment status, material consumption, defective product situation) during R&D experiments, small and medium-sized trials, and production auxiliary processes as required, ensuring that the data is true, complete, traceable, and without omissions or errors.   
    6、TheCan classify, screen, and summarize recorded data, use Excel to complete data statistics, assist core engineers in identifying data anomalies, and provide support for process optimization and project summary.   
    7、TheCan assist core engineers in preparing basic technical documents, such as initial drafts of process operation manuals (SOPs), experimental reports, material trial records, etc., to ensure that the document logic is clear, the content is in line with production reality, and conforms to factory document specifications.   
    8、TheHaving the awareness of document version management and archiving, able to classify and archive R&D documents, process data, equipment records, etc., standardize the management of document versions, avoid work errors caused by data confusion, and meet the traceability requirements of the quality management system.   

    Job requirements
    1、Education and major: Bachelor's degree or above, majoring in electronic information, electronic packaging, software engineering or related science and engineering.
    2、Experience and Practice: 1-2 years of experience as a research and development assistant in a packaging factory. As a core engineer in the R&D department (design, layout, front-end and back-end processes, project introduction, etc.), I play an auxiliary support role, focusing on the technical execution, data recording, production collaboration, and basic R&D assistance work of the entire packaging process (front-end slicing/mounting/bonding, back-end plastic packaging/cutting/testing/sorting), ensuring the implementation of R&D tasks, providing adequate production technical support, and accumulating practical experience to help the team efficiently promote project and process optimization.
    3、Having a proactive learning mindset, able to quickly absorb basic chip packaging technology knowledge, equipment operation skills, and process optimization ideas, actively participate in internal technical training and sharing in the factory, and gradually improve professional abilities.
    4、To accumulate experience in practice, learn problem-solving methods and project progression logic from core engineers, gradually acquire the ability to independently handle simple technical problems and complete basic R&D support work, and lay the foundation for subsequent promotion to core positions.
    5、Understand the basic technology trends of the industry and the upgrading needs of factory technology, actively learn the basic knowledge of new processes, equipment, and materials, cooperate with core engineers to carry out pre research and auxiliary work, and adapt to the development needs of the factory.
    6、Having a strong sense of responsibility and a rigorous and meticulous work attitude, strictly controlling various tasks such as data recording, document preparation, and practical operations, and eliminating work errors or production hazards caused by negligence.
    7、Have a sense of teamwork, actively cooperate with core engineers and team members to carry out work, actively undertake auxiliary tasks, proactively fill positions, and help the team efficiently promote research and development and production support work.   

    Molding Process Engineer

    Job responsibilities

    1、Process development and optimization, design and validate injection molding solutions for new packaging structures, improve product performance or adapt to new requirements.  
    2、Material selection, evaluate the flowability, thermal stability, CTE compatibility of packaging materials such as epoxy resin and fillers, and collaborate with suppliers to optimize formulations.
    3、Quality and reliability control, establishment of SPC control chart, real-time monitoring of key parameter fluctuations to ensure process stability.
    4、Optimize the packaging structure to adapt to the injection molding process and solve the problem of molding defects during the trial production stage.
    5、Document and compliance management, writing SOP, PFMEA, control plan and other documents to ensure compliance with standards such as IATF 16949.
    6、Intelligent solutions such as technological innovation and continuous improvement, automation upgrades, etc.
    Timely complete temporary tasks assigned by superiors or colleagues; 

    Job requirements

    1、College degree or above.
    2、Proficient in the process flow and key parameter control of semiconductor packaging injection molding.
    3、Familiar with packaging failure analysis methods (SEM, X-ray, ultrasonic scanning).
    4、More than three years of experience in semiconductor packaging molding, familiar with mainstream packaging forms such as QFN, BGA, LGA, etc.   
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  • WB technician
    Job responsibilities
    1、TheResponsible for the execution and operation of wire bond process in semiconductor packaging, ensuring product quality meets standards;   
    2、TheOperate and maintain wire bond equipment, conduct daily inspections and simple troubleshooting;   
    3、TheAssist engineers in adjusting and optimizing process parameters to improve production efficiency and product yield;   
    4、TheRecord and analyze production data, collaborate with the quality department to trace and improve issues.   

    Job requirements
    1、TheHigh school diploma or above, major not limited; 
    2、The1-3 years of work experience in wire bond or similar packaging processes, with semiconductor industry experience preferred;   
    3、TheFamiliar with the operation process of Wire Bond equipment and possess basic knowledge of equipment maintenance;   
    4、TheSerious and responsible in work, possessing good communication skills and teamwork spirit. 


    Molding molding technician

    Job responsibilities
    1、TheEquipment operation and maintenance: Responsible for the daily operation of TOWA molding machine, accurately setting equipment parameters according to production plans and process requirements, starting equipment for chip packaging molding production, ensuring stable and efficient production process.   
    2、Production process control: Strictly follow the process documents and operation instructions for molding production operations, control key process parameters such as molding temperature, pressure, and time, ensure product quality meets standard requirements, record various parameters and data during the production process, and facilitate subsequent quality traceability and analysis.   
    3、Quality control and improvement: Conduct quality inspection on molded products, use measuring tools and testing equipment to test product size, appearance, performance, etc., judge whether the product is qualified according to quality standards, identify, isolate and record non-conforming products, analyze the reasons for non-conforming products, propose improvement measures, and prevent problems from happening again.   
    4、Material and tool management: According to the production plan and process requirements, collect and prepare materials required for molding production, such as encapsulation resin, chip carriers, molds, etc. Check the quality and quantity of materials to ensure that they meet production requirements, properly store and preserve materials to prevent moisture, oxidation, pollution, and other situations.   

    Job requirements
    1、TheEducation background: College degree or above, major in mechanical automation or related fields is preferred; A high school/vocational school degree is required to have at least 1 year of experience in the packaging industry.   
    2、Work experience: At least 1-3 years of molding experience in the semiconductor chip packaging industry, familiar with TOWA molding machine operation, with relevant project experience preferred. Rich industry experience can enable technicians to quickly adapt to the work pace, proficiently deal with various situations that arise during the production process, and ensure the continuity and stability of production.   
    3、Skill requirements: Proficient in the operation, debugging, maintenance, and troubleshooting skills of TOWA molding machines, familiar with the various parameter settings of the equipment, able to make precise adjustments according to different production needs, and ensure efficient operation of the equipment.   
    4、Ability and quality: Possess strong problem-solving and analytical skills. In the process of molding production, when facing unexpected situations such as equipment failures and product quality issues, be able to quickly analyze the causes and propose effective solutions.   
    5、Other requirements: Able to adapt to shift work. The semiconductor chip packaging industry usually operates in a continuous production mode, and shift work helps ensure 24-hour uninterrupted production; Physically healthy and capable of handling heavy physical labor, as the job may require moving heavy objects such as molds and equipment components.   
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  • Integrated management
    Job responsibilities
    1、Responsible for following up and managing orders to ensure timely and high-quality completion;   
    2、Communicate and coordinate with customers, production, and logistics departments to handle order related issues;   
    3、Track order progress, provide timely feedback on abnormal situations, and assist in resolving them;   
    4、Organize and maintain order related information to ensure accuracy and correctness.   

    Job responsibilities
    1、College degree or above, major not limited, fresh graduates can also be considered;   
    2、Have good communication skills and a sense of responsibility, work meticulously and conscientiously;   
    3、Familiar with basic office software operations, such as Excel, Word, etc;   
    4、Has strong learning ability and can adapt to fast-paced work environments.   

    Material Officer  

    Job responsibilities
    1、Responsible for receiving, distributing, and managing inventory of materials required during the chip packaging production process;   
    2、Assist in the classification, identification, and placement of materials to ensure their orderly storage;   
    3、Cooperate with production line requirements and deliver materials in a timely and accurate manner;   
    4、Regularly conduct inventory checks to ensure consistency between accounts and goods, and promptly provide feedback on any abnormal situations.   

    Job requirements
    1、No relevant work experience required, preferably in the chip packaging industry; 
    2、Serious and meticulous in work, with a sense of responsibility and good communication skills;   
    3、Has team spirit and can obey arrangements;   
    4、(This position is a material handler for the production line, not for the warehouse, Changbai shift); 
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