Product Overview
This series of 2.5D/3D integrated packaging products is based on advanced heterogeneous integration technology, achieving system integration at the chip level through multi-layer wafer stacking and high-density interconnect architecture. We have broken through the physical limitations of traditional packaging, enabling the precise vertical stacking of up to 16 layers of FLASH wafers, or adopting a dual-channel tiling approach to complete integrated packaging. This provides customers with a one-stop packaging solution featuring higher density, higher performance, and smaller size, which is widely used in data centers, artificial intelligence, consumer electronics, automotive electronics, and other fields.
Technical Characteristics
Ultra-high stacking density: Supports vertical stacking of up to 16 layers of FLASH wafers, with a storage density more than 10 times higher than traditional packaging
Flexible integration approach: Provides two integration modes, vertical stacking and dual-channel tiling, which can be customized according to customer needs
High-density interconnect: Utilizing TSV (Through-Silicon Via) and micro-bump technology to achieve high-speed signal transmission between chips
Heterogeneous integration capability: Capable of integrating various semiconductor devices with different functions, such as logic chips, memory chips, sensors, etc
Precision process control: ±1μm bonding accuracy, ensuring reliability and consistency of multi-layer stacking
Electrical / Thermal Performance
Signal integrity: TSV interconnect technology shortens the signal transmission path by over 70%, significantly reducing signal delay
Bandwidth performance: Supports data transmission rates up to 3.2Gbps, meeting the needs of high-bandwidth applications
Power consumption optimization: Compared to traditional packaging solutions, the overall power consumption is reduced by 15%-20%
Thermal management: Utilizing advanced thermal design and thermal interface materials, it effectively addresses the heat dissipation issues arising from multi-layer stacking, with an operating temperature range of -40℃ to +125℃
Electrical reliability: Through rigorous reliability tests such as high and low temperature cycling, damp heat, and mechanical impact
earliest delivery time
Standard products: 15-20 working days
Customized products: 30-45 working days
Urgent orders: 7-10 working days (subject to additional assessment)
Minimum Order Quantity (MOQ)
Standard packaging specification: 1000 pieces
Customized packaging specification: 5000 pieces
Engineering samples: 10-50 pieces (corresponding engineering fees will be charged)
Product Type
Vertical Stacking Series: 4-Layer / 8-Layer / 12-Layer / 16-Layer FLASH Wafer Vertical Stacking Package
Dual-channel tiled series: 2-channel/4-channel FLASH wafer tiled integrated packaging
Mixed integration series: 3D integrated packaging of FLASH+DRAM + logic chip mixture
Customization Series: Providing customized 2.5D/3D integrated packaging solutions based on specific customer needs
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