Product Overview
This series of carrier board packaging products utilizes advanced packaging substrate technology, providing customers with a one-stop full-chain service from packaging carrier board design, raw material procurement, chip packaging to finished product testing. We have a professional technical team and a comprehensive production system, capable of deeply understanding customer needs and providing highly customized packaging solutions. This helps customers shorten their product launch cycles and enhance product competitiveness.
Technical Characteristics
Fully autonomous and controllable throughout the entire process: Mastering core technologies from carrier board design to finished product testing, ensuring seamless integration across all stages and guaranteeing product quality and delivery efficiency
Dual molding process configuration: Equipped with both die-cast molding and wet molding technologies, it can flexibly meet packaging requirements of different thicknesses and densities
High-precision packaging capability: Supports high-density pins and fine-pitch packaging, meeting the trend of miniaturization and high-performance development in high-end electronic products
Customized service system: Tailored packaging solutions can be provided based on customer's chip characteristics and application scenarios, including substrate materials, pin layout, package size, etc
Electrical / Thermal Performance
Excellent electrical performance: Utilizing low-dielectric-constant substrate materials effectively reduces signal transmission loss and crosstalk, ensuring the integrity of high-speed signals
Excellent heat dissipation capability: With an optimized thermal design structure, it can integrate heat sinks or metal substrates according to specific needs, significantly enhancing the chip's heat dissipation efficiency
Stable mechanical performance: The packaging structure is sturdy and exhibits good shock and vibration resistance, ensuring reliable operation of the product in various complex environments
Wide temperature range: Supports industrial and automotive temperature requirements, capable of stable operation in an environment ranging from -40℃ to 125℃
earliest delivery time
Standard sample: 7-10 working days
Small batch production: 15-20 working days
Mass production: 30-45 working days
Urgent orders: We can provide an urgent sample service within 3-5 working days
Minimum Order Quantity (MOQ)
Sample stage: 10-50 pieces
Small batch production: 500 pieces
Mass production: starting from 5000 pieces
Special customization requirements: Adjustments can be negotiated based on the actual situation of the customer
Product Type
LGA (Land Grid Array) package: suitable for products with high space requirements and a moderate number of pins
BGA (Ball Grid Array) packaging: including PBGA, CBGA, TBGA, and other types, suitable for high-pin count, high-performance chips
Customized carrier board packaging: Provide customized packaging services with non-standard dimensions, special pin definitions, and integration of special functions according to customers' specific needs
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