High-density SIP system-level packaging product

Heterogeneous integration provides a one-stop solution, empowering electronic systems with miniaturization and high performance

Integrating different functional chips and module systems into a single package, utilizing a combination of flip-chip and wire bonding techniques, achieves smaller size, higher integration, and superior system performance

YDCHIP

Product dimensions:It can be customized according to system integration require...

Application fields:Fingerprint recognition module, wireless communication module, IoT terminal, wearable device, smart ...

Detailed Introduction

Product Overview

SIP (System-in-Package) is an advanced heterogeneous integration technology that breaks through the physical limitations of traditional single-chip design and manufacturing. By integrating bare chips or sub-modules of different process nodes and functions, such as processors, memories, sensors, and radio frequency units, in a single package through three-dimensional or two-dimensional integration, a complete electronic system is constructed. This technology effectively shortens the product development cycle, reduces system costs, and significantly enhances the overall performance and reliability of the system. It is the core solution for the miniaturization and intelligence of electronic systems in the post-Moore era.

Technical Characteristics

Mixed bonding technology: flexibly adopting a process combining flip chip and wire bonding, balancing high-density interconnection and cost-effectiveness

Multi-dimensional integration capability: Supports 2D planar integration, 2.5D interposer integration, and 3D stack integration, enabling chip-level system architecture

High-density interconnect: The minimum line width/line spacing can reach 15μm/15μm, significantly enhancing I/O density

Modular design: Support the rapid combination of pre-verified functional modules to shorten the time to market

Process compatibility: compatible with various packaging carriers such as silicon-based, ceramic-based, and organic substrates

Electrical / Thermal Performance

Excellent signal integrity: Shorter interconnect paths significantly reduce signal delay, crosstalk, and transmission loss

Excellent power integrity: Integrated decoupling capacitors and optimized power distribution network reduce power noise

Efficient thermal management: Provides a variety of cooling solutions, including metal heat sinks, thermal vias, embedded heat sinks, etc

Thermal resistance range: Depending on the package size and heat dissipation scheme, the junction-to-case thermal resistance can be as low as 0.5℃/W

Operating temperature range: Supports an industrial temperature range of -40℃ to +125℃, with customization options for automotive and military-grade products

earliest delivery time

Standard process platform: 4-6 weeks

Customized design: 8-12 weeks

Urgent order: fastest 3 weeks (requires advance evaluation)

Minimum Order Quantity (MOQ)

Engineering samples: minimum order quantity of 10 pieces

Small batch production: minimum order quantity of 100 pieces

Mass production: minimum order quantity of 1000 pieces

Special customization project: to be determined through negotiation based on specific needs

Product Type

Consumer electronics SIP: applicable to smartphones, wearable devices, smart homes, etc

Communication SIP: applicable to 5G/6G base stations, optical modules, satellite communications, etc

Automotive electronics SIP: suitable for ADAS, in-vehicle entertainment, power control systems, etc

Industrial control SIP: applicable to industrial sensors, PLCs, robots, etc

Medical electronics SIP: applicable to portable medical devices, implantable medical devices, etc

Aerospace SIP: applicable to satellites, drones, avionics systems, etc

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