Product Overview
SIP (System-in-Package) is an advanced heterogeneous integration technology that breaks through the physical limitations of traditional single-chip design and manufacturing. By integrating bare chips or sub-modules of different process nodes and functions, such as processors, memories, sensors, and radio frequency units, in a single package through three-dimensional or two-dimensional integration, a complete electronic system is constructed. This technology effectively shortens the product development cycle, reduces system costs, and significantly enhances the overall performance and reliability of the system. It is the core solution for the miniaturization and intelligence of electronic systems in the post-Moore era.
Technical Characteristics
Mixed bonding technology: flexibly adopting a process combining flip chip and wire bonding, balancing high-density interconnection and cost-effectiveness
Multi-dimensional integration capability: Supports 2D planar integration, 2.5D interposer integration, and 3D stack integration, enabling chip-level system architecture
High-density interconnect: The minimum line width/line spacing can reach 15μm/15μm, significantly enhancing I/O density
Modular design: Support the rapid combination of pre-verified functional modules to shorten the time to market
Process compatibility: compatible with various packaging carriers such as silicon-based, ceramic-based, and organic substrates
Electrical / Thermal Performance
Excellent signal integrity: Shorter interconnect paths significantly reduce signal delay, crosstalk, and transmission loss
Excellent power integrity: Integrated decoupling capacitors and optimized power distribution network reduce power noise
Efficient thermal management: Provides a variety of cooling solutions, including metal heat sinks, thermal vias, embedded heat sinks, etc
Thermal resistance range: Depending on the package size and heat dissipation scheme, the junction-to-case thermal resistance can be as low as 0.5℃/W
Operating temperature range: Supports an industrial temperature range of -40℃ to +125℃, with customization options for automotive and military-grade products
earliest delivery time
Standard process platform: 4-6 weeks
Customized design: 8-12 weeks
Urgent order: fastest 3 weeks (requires advance evaluation)
Minimum Order Quantity (MOQ)
Engineering samples: minimum order quantity of 10 pieces
Small batch production: minimum order quantity of 100 pieces
Mass production: minimum order quantity of 1000 pieces
Special customization project: to be determined through negotiation based on specific needs
Product Type
Consumer electronics SIP: applicable to smartphones, wearable devices, smart homes, etc
Communication SIP: applicable to 5G/6G base stations, optical modules, satellite communications, etc
Automotive electronics SIP: suitable for ADAS, in-vehicle entertainment, power control systems, etc
Industrial control SIP: applicable to industrial sensors, PLCs, robots, etc
Medical electronics SIP: applicable to portable medical devices, implantable medical devices, etc
Aerospace SIP: applicable to satellites, drones, avionics systems, etc
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