About Us
About Us
Company Profile
Corporate Culture
Development History
Production Base
Honor and Qualification
Yudixin Semiconductor Technology (Shenzhen) Co., Ltd
          Yudixin Semiconductor Technology (Shenzhen) Co., Ltd. is a high-tech enterprise in China that focuses on rapid chip packaging and advanced packaging testing, with a focus on semiconductor packaging and testing; Short cycle, high flexibility, and high reliability; Our core requirement is to provide a one-stop solution for global chip design, Fabless, AIoT, and automotive electronics customers, covering packaging design, process development, sample quick packaging, and mass production. 

          The company is deeply engaged in the field of rapid packaging, with core technologies covering traditional chip packaging and testing (DFN, QFN, BGA, etc.), system level packaging (SiP), 2.5D/3D intermediate layer packaging, and packaging of special chips (medical products, etc.), and self-developed; Wafer level parallel process+forward testing+focused packaging and testing+modular integration; System, breaking the bottleneck of traditional closed beta testing with long cycles; — Samples can be delivered within 24 hours at the fastest, while regular orders can be delivered within 2 hours; Completed in 3 weeks, with a 50% increase in efficiency compared to traditional packaging; 75%. 

            We have a thousand level dust-free workshop and a fully automated packaging and testing production line, equipped with high-end equipment such as SMT, die bonding, bonding, plastic packaging, laser cutting, and parallel ATE testing. We have passed ISO9001 quality system certification and IATF16949 automotive chip certification, and have established a comprehensive system from wafer thinning to RDL rewiring Bumping、 The full process quality control system from cutting and assembly to aging testing ensures that yield and reliability are benchmarked against international standards. 

          The core team is composed of senior experts and technical backbones in the field of semiconductor packaging and testing, with an average of over 15 years of industry experience. They possess advanced packaging technology research and development and mass production capabilities, and have served hundreds of customers, covering core areas such as integrated storage products, AI sensor products, RF devices, MEMS sensors, automotive electronics, and industrial control. 

          Adhere to the principle of; Technology empowers fast sealing, quality achieves value; Our philosophy is to take domestic substitution as our responsibility, continuously break through advanced packaging key technologies, optimize supply chain response efficiency, and strive to become a leading global provider of fast packaging solutions, helping customers shorten research and development cycles, reduce production costs, accelerate product launch, and create a new ecosystem for the semiconductor industry.
300 million
Output value in 2025
Will exceed 300 million
In 2023
The company was 
established in
May 2023
5000m²
Ten thousand level 
purification workshop
Yudixin adheres to the concept and principle of customer first and establishes a sound quality management system
Since its establishment, the company has been focusing on the research field of integrated circuit testing technology, and has accumulated multiple independent core third-party testing technologies in this field. It provides overall testing technology solutions for many well-known integrated circuit design companies in China. After more than ten years of development, it has become an innovative service base for integrated circuit testing in terms of testing scale, technical capabilities, customer service, and other aspects in the field of integrated circuit testing in China.