Product Overview
Our company specializes in advanced frame-type semiconductor packaging technologies such as QFN/DFN, providing customers with a one-stop solution from design to mass production. Leveraging our extensive mold resources, cutting-edge production equipment, and rigorous quality control system, we are able to swiftly respond to customers' customized needs while ensuring high reliability and consistency of our products. Our products are widely used in various fields such as consumer electronics, automotive electronics, industrial control, and communication equipment, offering superior packaging protection and performance enhancement for various semiconductor chips.
Technical Characteristics
Flexible customization capability: We can provide customized frame size services according to customers' product size requirements, perfectly matching their chip designs
Abundant public mold resources: Hundreds of standard framework public molds are available for selection, significantly shortening the product development cycle and enabling rapid mass production
High reliability design: All products meet MSL1 (Moisture Sensitivity Level 1) requirements, allowing for indefinite storage in an environment with 30℃/85% RH, and can be used without baking
Ultra-thin packaging process: Equipped with dedicated plastic molding tools and high-precision grinding equipment, it supports the packaging of ultra-thin discrete devices, achieving a minimum package thickness of 0.3mm
Advanced manufacturing technology: Utilizing high-precision wire bonding, plastic molding, and cutting techniques to ensure the electrical connection stability and mechanical strength of the product
Electrical / Thermal Performance
Excellent electrical performance: The QFN/DFN package adopts a leadless design, featuring shorter signal paths, effectively reducing parasitic inductance and resistance, and enhancing high-frequency performance
Excellent heat dissipation capability: The design of a large-area exposed solder pad at the bottom provides a direct heat dissipation channel, significantly reducing the operating temperature of the chip and extending the product's service life
Low impedance connection: Utilizing a copper frame and high-purity solder wires, ensuring excellent conductivity and signal transmission quality
Wide temperature range operation: The product can operate stably within a wide temperature range from -55℃ to +155℃, adapting to various harsh application environments
earliest delivery time
Standard public mold products: Samples can be provided within 3-5 working days at the fastest, and mass production can be completed within 7-10 working days at the fastest
Customized products: Samples can be produced within 10-15 working days at the fastest, while mass production can be completed within 15-20 working days at the fastest
Expedited service is available for urgent orders, with specific delivery dates to be negotiated separately
Minimum Order Quantity (MOQ)
Standard public mold products: sample minimum order quantity is 100 pcs, and batch minimum order quantity is 10K pcs
Customized products: MOQ for samples is 500pcs, and MOQ for bulk orders is 50Kpcs
Special requirements can be negotiated and adjusted according to the actual situation of the customer
Product Type
QFN series: including standard QFN, ultra-thin QFN, QFN with heat sink, multi-row pin QFN, etc
DFN series: including standard DFN, ultra-thin DFN, double-sided pin DFN, quad-sided pin DFN, etc
Other frame-type packages: SOT, SOP, TSOP, TSSOP, and various other packaging forms
Customized packaging: Providing non-standard frame-type packaging design and manufacturing services according to customers' specific needs
English
