Highly reliable special packaging chip series helps medical products achieve large-scale mass production

1、 Project Background and Industry Challenges

With the rapid development of medical electronic technology, life support devices such as implantable pacemakers, neurostimulators, insulin pumps, as well as high-end medical equipment such as in vitro diagnostics (IVD) and medical imaging, have put unprecedented demands on the reliability and safety of core chips. Traditional plastic encapsulated chips have problems such as poor airtightness, low mechanical strength, and insufficient biocompatibility, which cannot meet the long-term working needs of implantable devices in the human body, and are also difficult to cope with complex environments such as temperature fluctuations and mechanical vibrations that medical devices may encounter during transportation and use.

At the same time, the medical industry has extremely strict regulatory standards, and implantable products must pass international authoritative biocompatibility certification. Any minor quality defects may endanger the patient's life safety. How to achieve high reliability, long lifespan, and biosafety packaging while ensuring chip performance, and meet the requirements of large-scale production, has become a key technological bottleneck restricting the localization of high-end medical equipment.

2、 Customized overall solution

We have launched a full range of highly reliable special packaging chip solutions to meet the special needs of the medical industry, providing customers with one-stop services from design, research and development to mass production.

In terms of packaging form, various standard packages such as ceramic DIP, ceramic QFP, metal TO, metal tube shell, and airtight BGA can be provided, while supporting fully customized packaging structure design. According to the integration requirements of different medical devices, flexibly adjust pin definitions, packaging sizes, and surface treatment processes to ensure perfect compatibility with customer products.

In terms of internal structural design, customized gold wire bonding and copper strip bonding interconnection technologies are adopted to optimize the bonding path and density according to the chip power level. Innovative design of embedded heat dissipation channels for high-power medical chips significantly improves heat conduction efficiency and avoids performance degradation or failure caused by overheating.

To ensure the stable operation of medical equipment in complex electromagnetic environments, the solution integrates multi-layer electromagnetic shielding structures and electrostatic discharge (ESD) design, strictly following the GJB 151 military grade electromagnetic compatibility standard, effectively suppressing electromagnetic interference, preventing static electricity from damaging chips, and ensuring the accuracy and reliability of equipment signal transmission.

3、 Core Technology and Product Highlights

This series of highly reliable special packaging chips has reached industry-leading levels in material selection, process control, and performance indicators, fully meeting the stringent requirements of medical and other extreme environmental applications.

In terms of materials and airtightness, high-purity alumina ceramics and Kovar alloy are used as the main packaging materials, and ultra-high airtightness of ≤ 1 × 10 ^ -9 Pa · m ³/s is achieved through precise sintering and welding processes. This indicator is much higher than industry standards and can effectively prevent body fluids, water vapor, and other corrosive substances from entering the chip, providing fundamental protection for implantable devices to work in the human body for a long time.

In terms of environmental adaptability, the product supports an ultra wide temperature range of -55 ℃ to 150 ℃, and can withstand mechanical impacts of over 1000g and random vibrations of 50g. Whether it is the continuous vibration generated by human activities after implantation, or the severe collisions that medical equipment may encounter during transportation and emergency treatment, the chip can maintain stable operation. At the same time, the product also has excellent resistance to radiation, salt spray, and corrosion, and can work reliably for a long time in harsh environments such as high altitude, ocean, and space.

In terms of biosafety, all implant grade products have passed the ISO 10993 full biocompatibility certification and undergone strict tests for cytotoxicity, allergenicity, irritancy, genetic toxicity, etc. to ensure that they will not cause any adverse reactions after implantation in the human body, fully complying with international medical device regulations.

In terms of reliability assurance, we have established a comprehensive full process reliability testing and verification system. Each batch of products needs to undergo multiple rigorous tests such as 1000 cycles of high and low temperature, 1000 hours of wet heat aging, and long-term life testing, simulating various environmental stresses that the products may encounter throughout their entire lifecycle, ensuring that the products have a service life of more than 10 years and providing reliable guarantees for the long-term stable operation of medical equipment.

4、 Widely applied in multiple fields

In addition to the medical field, this series of highly reliable special packaging chips has successfully expanded to multiple fields with extremely high reliability requirements, such as industrial and military aerospace, due to their excellent performance.

In the industrial field, it can be applied to products such as downhole sensors for oil drilling, high-temperature and high-pressure industrial controllers, high-voltage power modules for new energy vehicles, and signal processing chips for rail transit. It can work stably in harsh industrial environments such as high temperature, high pressure, and strong vibration, improving the operational reliability and service life of industrial equipment.

In the field of military aerospace, it can meet the packaging requirements of products such as satellite communication chips, avionics system chips, missile guidance chips, underwater detection equipment chips, etc. It can withstand extreme environmental tests such as space radiation, deep-sea high pressure, and extreme temperature, providing core technical support for the modernization of national defense and the development of aerospace industry.

5、 Project outcomes and customer value

Through the implementation of this project, we have successfully achieved large-scale production of highly reliable special packaging chips in the medical field, helping multiple medical equipment companies solve the technical challenges of core chip packaging. The implantable cardiac pacemaker, neurostimulator and other products using this scheme have been successfully launched and put into clinical use, and their stability and reliability have been unanimously recognized by doctors and patients.

For customers, our solution not only provides high-performance packaged products, but also significantly shortens the R&D cycle and reduces R&D costs through full process technical support and customized services. At the same time, a strict quality control system and comprehensive reliability testing ensure the consistency and long-term stability of customer products, helping customers quickly pass medical device registration and approval, and enhancing the market competitiveness of products.

In the future, we will continue to deeply cultivate the field of high reliability special packaging technology, continuously innovate materials and processes, and launch more packaging solutions that meet the needs of different industries, contributing to the localization process of high-end electronic devices in China.