What is semiconductor packaging? UDICore takes you on a deep dive into packaging technology and core methods

1、 What is semiconductor packaging? The "protective shell" and "connector" of the chip

Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. Simply put, it is like putting a "protective suit" on fragile chips and building a "bridge" between the chip and external circuits.

The Four Core Functions of Semiconductor Packaging

Physical protection: Protect the chip from external factors such as mechanical damage, moisture, corrosion, and static electricity, ensuring stable operation of the chip in various complex environments.

Electrical connection: Connect the tiny pins inside the chip to the pins or solder balls outside the package through metal wires or bumps, to achieve signal transmission and power supply between the chip and the circuit board.

Thermal management: Through packaging materials and structural design, the heat generated during chip operation is effectively dissipated to prevent chip damage or performance degradation due to overheating.

Standard Integration: Integrating chips with different functions into one package to form System in Package (SiP), achieving miniaturization, lightweighting, and high performance to meet the needs of various end products.

2、 Core Technologies and Methods of Semiconductor Packaging: Evolution from Traditional to Advanced

Semiconductor packaging technology has gone through a long development process from traditional packaging to advanced packaging. With the continuous improvement of electronic devices' requirements for chip performance, size, and power consumption, advanced packaging technology has become the mainstream direction of industry development.

Traditional packaging technology

Traditional packaging technologies mainly include dual in line package (DIP), small form factor package (SOP), square flat package (QFP), square flat no pin package (QFN), and ball grid array package (BGA). These technologies have the advantages of mature processes, low costs, and high reliability, and are still widely used in fields such as consumer electronics, industrial control, and automotive electronics.

Advanced packaging technology

Advanced packaging technology refers to the use of finer processes and more complex structures to achieve higher density, higher performance, and lower power consumption in packaging technology. The current mainstream advanced packaging technologies include:

Wafer level packaging (WLP): Directly packaging on a wafer and then cutting it into individual chips, it has the advantages of small size, good performance, and low cost. Among them, Fan Out wafer level packaging (WLP) breaks through the limitation of chip area and can achieve higher pin density and better heat dissipation performance.

2.5D packaging: High density horizontal interconnection of multiple chips is achieved through a silicon intermediate layer (Interposer), which is equivalent to building an additional set of "ultra high speed interconnection bus" on a regular packaging substrate, especially suitable for the integration of high computing power chips and high bandwidth memory (HBM).

3D packaging: Achieving higher integration through vertically stacked chips, utilizing through silicon via (TSV) or hybrid bonding technology to achieve high-speed electrical interconnection between layers. As an advanced packaging "crown technology", hybrid bonding technology can compress the interconnect spacing from the traditional 10 μ m to below 1 μ m, increase interconnect density by more than 10 times, and reduce power consumption by more than 30%.

Chiplet technology: Breaking down the originally bulky system on chip (SoC) into multiple functionally independent bare chips, and then reassembling them through advanced packaging technology, like building blocks. This technology can significantly improve chip yield, reduce manufacturing costs, and shorten product launch cycles, making it an important direction for the development of the semiconductor industry in the post Moore era.

3、 Yudixin: Innovation Pioneer in China's Semiconductor Packaging Industry

Yudixin Semiconductor Technology (Shenzhen) Co., Ltd. is a wholly-owned subsidiary of Yixin Micro Semiconductor Technology (Shenzhen) Co., Ltd. It is a high-tech enterprise specializing in storage packaging and testing, module manufacturing, sensor packaging and testing, and module solutions. The company is located in Zhongcheng Biomedical Industrial Park, Pingshan District, Shenzhen, with 1500 square meters of Class 1000 and 50 square meters of Class 10000 purification workshops, providing a high-level office production environment and management level in the industry.

Core technological advantages

Yudixin focuses on the research and innovation of advanced packaging and testing technology, and has mastered multiple core technologies:

Fan Out WLP wafer level packaging: Breaking through the limitation of chip area, extending I/O to the periphery of the wafer with a rewiring layer, achieving higher pin density, thinner appearance, and excellent heat dissipation, suitable for mobile, RF, and high-performance computing fields.

Chiplet Heterogeneous Integration: Using Chiplet microsystem architecture, the computing power chips, I/O chips, and HBM 3D stack of different process nodes are encapsulated at once through high-speed interfaces, achieving a 40% performance improvement and a 35% cost reduction.

TSV through silicon via technology: Build a 3D matrix via interconnect system to achieve vertical high-speed connections between chips, greatly improving data transmission bandwidth.

System in Package (SiP): Integrating multiple functional chips such as processors, memory, sensors, etc. into one package, providing customers with highly integrated system level solutions.

One stop full chain service

Yudixin adopts a business model of "research and development, packaging and testing, and module integration", integrating storage solution research and development, advanced packaging and testing, module assembly testing and services, and brand operation. The company provides customers with a full chain "one-stop" solution from chips to finished modules, covering:

Embedded storage encapsulation testing

Sensor packaging testing

Multi chip heterogeneous integration

QFN, FCBGA, SiP and other packaging and testing services

Packaging+module assembly+PCBA solution finished product testing

Strict quality control system

Yudixin attaches great importance to product quality and reliability, and has successively passed the ISO9001:2015 quality management system, ISO14001 environmental management system, ISO45001 occupational health and safety certification system, and IATF16949 international automotive industry quality management system standard certification. The company has established a comprehensive quality control process, strictly controlling every link from raw material procurement to production and manufacturing to finished product inspection, ensuring that product quality meets international advanced standards.

4、 Advanced packaging leads the post Moore era

With the rapid development of emerging technologies such as artificial intelligence, big data, cloud computing, and autonomous driving, the global semiconductor industry's demand for high-performance and highly integrated chips continues to grow. Advanced packaging technology, as a key path to improving chip performance in the post Moore era, will usher in unprecedented development opportunities.

Yudixin will continue to increase research and development investment, continuously break through the bottleneck of advanced packaging technology, and focus on developing cutting-edge technologies such as hybrid bonding, glass substrates, and optoelectronic co packaging (CPO). At the same time, the company will deepen cooperation with upstream and downstream enterprises, build a complete semiconductor packaging and testing industry chain ecosystem, and provide customers with higher quality, efficient, and customized solutions.

'down-to-earth, harmonious and win-win 'is the working style that Yudixin always adheres to. In the future, Unichip will continue to adhere to the core concept of "customer-centric, continuous development and innovation", and with strong technological strength and a perfect service system, help China's semiconductor industry achieve high-quality development, and contribute Chinese strength to the progress of the global electronic information industry.

About Unichip Semiconductor

Yudixin Semiconductor Technology (Shenzhen) Co., Ltd. is committed to creating an advanced semiconductor chip packaging, testing, and module manufacturing enterprise, providing customers with a one-stop solution for the entire chain from chips to finished modules. The company's products are widely used in various fields such as consumer electronics, automotive electronics, industrial control, medical equipment, new energy, etc., and have won unanimous praise and trust from domestic and foreign customers.